- Grad. BEM
- Grad. IEM
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- Insulated Cu Wire Free Air Ball Characterization, Microelectronic Reliability 2014.
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- Characterization of Insulated Cu Wire Ball Bonding, Materials Research Innovations 2014.
- Fine Pitch Wire Bonding with Insulated Cu Wire: Free Air Ball and Ball Bond,The Malaysia-Japan Model on Technology Partnership, Springer 2015.
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