Dr. Leong Hung Yang

Dr. Leong Hung Yang

Research Impact:

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Dr. Leong Hung Yang

Lecturer | Department of Electrical & Electronic Engineering

Academic Qualifications

PhD Engineering
Bachelor Electrical
Diploma Telecommunication Engineering

Areas of Interest
Internet of Things and Wireless Sensor Network
Image Processing
IC Packaging , Microelectronics and Material Science
Professional Bodies

  1. Grad. BEM
  2. Grad. IEM
  3. MIET 


  1. Wire Bonding Apparatus and Method US Patent 20140263584 A1, September 2014.
  2. Insulated Cu Wire Free Air Ball Characterization, Microelectronic Reliability 2014.
  3. Stitch Bond Strength Study in Insulated Cu Wire Bonding, Materials Research Innovations 2014.
  4. Characterization of Insulated Cu Wire Ball Bonding, Materials Research Innovations 2014.
  5. Fine Pitch Wire Bonding with Insulated Cu Wire: Free Air Ball and Ball Bond,The Malaysia-Japan Model on Technology Partnership, Springer 2015. 
  6. Manufacturability Readiness of Insulated Cu Wire Bonding Process in PBGA Package, 16th Electronic Packaging Technology Conference (EPTC), Singapore 2014. 7. Development of Insulated Cu Wire Ball Bonding, 35th International Electronic Manufacturing Technology Conference (IEMT), Malaysia, 2012.