How can Malaysia build the high-skilled engineering talent needed to move beyond assembly and become a serious player in semiconductor design and advanced packaging? This question was explored as UCSI brought together industry and government leaders from across the semiconductor ecosystem.
Panellists Selangor Information Technology and Digital Economy Corporation (Sidec) technical director Dr Lee Hing Wah, Fitipower Integrated Technology Inc deputy manager (CAD division) Wang Hao Yu, and SkyeChip vice-president (Client Service) Teoh Giap Seng highlighted the need for meaningful internships and stronger academia–industry collaboration. They also called for more opportunities for students to gain hands-on experience with real-world technologies and participate in competitions that showcase their capabilities.
In line with these priorities, UCSI University has launched the Master in Engineering (Applied AI). The practical programme is designed for graduates and working professionals seeking to apply AI to real engineering challenges in semiconductors, electronics, advanced manufacturing, automotive, aerospace, biomedical engineering and smart factories.
Designed with industry needs in mind, the programme prepares learners for high-value roles in the evolving AI and semiconductor ecosystem.
UCSI University said the initiative reflects its ongoing effort to translate discussions on Malaysia’s talent gap into concrete action for the country’s future.
